Intel has introduced its latest generation of Atom microprocessors aimed at Internet of Things (IoT) applications – the Intel Atom E3900 and the Intel Atom A3900. Both series take advantage of 14nm process chip manufacturing and claim to offer 1.7 times the compute power over the previous generation Atom processors. The Atom E3900 series in aimed across various IoT devices whereas the A3900 series will specifically address automative-grade and in-vehicle experiences.
You can read the full press release below:
The Intel Atom processor A3900 and E3900 Series delivers performance and a unique set of features for the edge in segments such as industrial, automotive, video, manufacturing, retail, and more.
Intel is also offering an automotive grade processor specifically to address in-vehicle experiences called the Intel Atom processor A3900 series.
Powering Connected Machines Across New Markets
IoT is expected to be a multi-trillion-dollar market, with 50 billion devices1 creating 44 zettabytes (or 44 trillion gigabytes) of data annually by 2020, require much more processing power at the edge in order to maintain viability. The new Intel Atom processor E3900 series will be used across industries to realize the full potential of IoT, creating a wave of change in how we live and work. Key improvements include:
Excellent CPU performance, fast GFX and media, image processing and Intel Time Coordinated Computing Technology (Intel TCC Technology)
Achieves new levels of security, determinism, and image and video processing power in a compact form factor
Delivers ability to handle more sensors and tasks across extended temperatures (TA -40 – 85 degrees Celsius), which is especially critical for industrial use cases
Keeps systems of devices in sync in reduced latency across a wide variety of applications
Delivering Advanced Solutions for the Next Generation of Smart and Connected Products
Enhanced CPU in a small, power-efficient package. The Intel Atom processor E3900 series delivers 1.7 times more computing power compared to the previous generation at the edge of IoT operations, for faster memory speeds and memory bandwidth. Built into a compact flip chip ball grid array (FCBGA) and featuring Intel’s latest 14 nanometer silicon technology, it is an excellent fit for a wide range of IoT applications when scalable performance, space and power are at a premium.
Increased graphics and media processing performance. The processor offers powerful graphics and media capabilities in a flexible package, opening new opportunities for those creating systems for media-rich applications. It features a new graphics engine that improves 3-D graphics performance by 2.9 times compared to the previousgeneration, offers outstanding video capabilities. It also features enhanced image processing with amazing color
processing and multi-frame technology.
Intel TCC Technology. Intel TCC Technology synchronizes peripherals and networks of connected devices, achieving determinism. It also resolves latency issues in applications, such as robotics manufacturing, by enabling 1 microsecond timing accuracy across the network.
Fast, strong processing and sensor integration at the edge. The Intel Atom processor E3900 series will make the edge and fog more intelligent – enabling many of the processing needs to take place right at the edge or fog level and alleviating the need to push all data processing to the data center. For example, in traffic cams and sensor data, there are significant downsides to sending the data to a server to be processed, including loss due to video compression and time spent in data travelling, versus having the ability to process data at the device.
Building the Future of IoT
Intel is collaborating with a diverse ecosystem of leading IoT device and equipment manufacturers, software vendors and OEMs, including Delphi, FAW, Neusoft and Hikvision. Through these collaborations, Intel will enable a broad range of optimized and interoperable, multivendor solutions using the Intel Atom processor E3900 series across industries. Sample uses include:
Industrial: Predictive maintenance, accelerated time to market and increased quality and remote management
Digital security and surveillance (DSS)/vision systems (video): Visual data identification and analysis, safety and security, traffic management and monitoring, agriculture and pipeline monitoring, and manufacturing inspection
Transportation/automotive: Software-defined cockpits and vehicle-to-vehicle communication; additionally, the Intel Atom processor A3900 series will specifically address automotive-grade, in-vehicle experiences
This latest Intel Atom processor for IoT is a major step in Intel’s strategy to enable industries to unlock the promise of IoT. Intel is uniquely positioned to enable every segment of the smart and connected world – powering the majority of the world’s data centers, connecting hundreds of millions of IoT devices and fulfilling the promise of always-on, 5G connectivity, deep machine learning, and security and privacy.
Lineup and Availability
This announcement of Intel Atom processor E3900 series will include the following SKUs:
Intel Atom x5-E3930 processor
Intel Atom x5-E3940 processor
Intel Atom x7-E3950 processor
Device: Intel CRB; CPU: Intel® Atom™ processor x5-E3930; OS: CentOS 7 64-bit kernel 3.10.0-123el7; Memory: 4x2GB LPDDR4-2133; Storage: Intel 520 Series SSD 120GB.
Device: Intel CRB; CPU: Intel® Atom™ processor E3825; OS: CentOS 6.4 64 bit kernel 3.5.0;
Memory: 1x4GB DDR3L-1066; Storage: Western Digital* HDD 250GB.
SPEC* CPU2006 is a benchmark from the SPEC consortium that measures device performance and throughput using compute intensive application subtests. SPECint*_base2006 measures how fast a device completes a single integer compute task. SPECint*_rate_base2006 measures throughput, or how many integer compute tasks a device can accomplish in a given amount of time. OS support: Desktop Windows*.
2As measured by 3DMark*11 Performance
3DMark* 11 Performance
Device: Intel CRB; CPU: Intel® Atom™ processor x7-E3950; OS: Microsoft* Windows* 10 Enterprise 64-bit; Memory: 4x2GB LPDDR4-2400; Storage: Samsung* SSD 750 EVO 120GB; Graphics: 9th gen Intel LP graphics; Graphics Driver: 15.42.4438
Device: Intel CRB; CPU: Intel® Atom™ processor E3845; OS: Microsoft* Windows* 8 64-bit ; Memory: 2x4GB DDR3-1333; Storage: Intel 320 SSD 40GB; Graphics: 7th gen Intel LP graphics; Graphics Driver: 10.18.10.3925
3DMark* 11 is a benchmark from Futuremark* that measures DX 11 gaming performance. There are four DX 11 graphics tests with three quality presets: Entry, Performance, Extreme. Reported metrics: Graphics Score (GPU), Physics Score (CPU), Combined Score (GPU & CPU) and an overall 3DMark Score (higher is better for all Scores). OS support: Desktop Windows.